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Exhibition

Meeting | Meet you at Semiexpo Shenzhen 2020

2020-12-04 from:
Meeting time: December 8-10, 2020
Venue: Hall 2/4, Shenzhen International Convention and Exhibition Center
Booth No.: A610
Brief introduction:
On December 8-10, 2020, the third Shenzhen International Semiconductor and 5G Application Exhibition will be held in Shenzhen International Convention and Exhibition Center (Bao'an), and dozens of enterprises in emerging application fields, such as AI, automatic driving, Internet of Things, 5G communication, intelligent terminals, intelligent sensors, will be invited to participate in the exhibition. In combination with 5G applications, the exhibition will display new application solutions, including communication Internet of Things applications, 5G terminal solutions, in addition to the display of design, sealing and testing and manufacturing processes, equipment and materials. At that time, Michaelina will show you the latest products and technologies.
 
Mikrouna sincerely invites you to visit our booth (A610) for exchange, and looks forward to working with you to help the development of the semiconductor industry!
 
Highlights of this exhibition
raw material
Silicon wafer, silicon wafer, photoresist, photomask, electronic gas and special chemical gas, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, sealing materials;
Production equipment
Single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machine, etching machine, polishing machine, chamfering machine, gluing/developing machine, previous test equipment, wet process equipment, hot processing, coating equipment, single crystal deposition system, cleaning equipment;
Packaging process and equipment
Thinner, dicing machine, wire bonder of placement machine, plastic sealing machine, bending equipment, sorting machine, testing machine, robot automation, machine vision, other materials and special electronic equipment;
Supporting products for testing and packaging
Probe card, wire bonding, welding test, automatic test, laser cutting and others, grinding fluid, scribing fluid, sealing film (adhesive) high temperature tape, laminated substrate, patch adhesive, feeding plate, welding wire, flow control, quartz graphite, silicon carbide, etc;
5G communication
Scheme, equipment, components, new materials and applications;
Mikrouna (Shanghai) Ind. Int. Tech. Co., Ltd.
Service Hotline:400-990-6600

021 6818 2710 / 2723 / 2736

sales@mikrouna.com

111 Tingyi Road, Tinglin Town, Jinshan District, Shanghai

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